Template-type: ReDIF-Paper 1.0
Author-Name: Chia-Lin Chang
Author-Email: changchialin@nchu.edu.tw
Author-Person: pch286 
Author-Workplace-Name: Department of Applied Economics, Department of Finance, National Chung Hsing University, Taiwan.
Author-Name: Michael McAleer
Author-Person: pmc90 
Author-Workplace-Name: Econometric Institute, Erasmus School of Economics, Erasmus University Rotterdam and Tinbergen Institute,
	The Netherlands, Department of Quantitative Economics, Complutense University of Madrid, and Institute of
	Economic Research, Kyoto University. 
Author-Name: Ju-Ting Tang
Author-Workplace-Name: Department of Applied Economics National Chung Hsing University, Taiwan.
Title: International Technology Diffusion of Joint and Cross-border Patents (Revised version)
Abstract: With the advent of globalization, economic and financial interactions among countries have become widespread. Given 
	technological advancements, the factors of production can no longer be considered to be just labor and capital. In the pursuit 
	of economic growth, every country has sensibly invested in international cooperation, learning, innovation, technology 
	diffusion and knowledge. In this paper, we use a panel data set of 40 countries from 1981 to 2008 and a negative binomial 
	model, using a novel set of cross-border patents and joint patents as proxy variables for technology diffusion, in order 
	to investigate such diffusion. The empirical results suggest that, if it is desired to shift from foreign to domestic 
	technology, it is necessary to increase expenditure on R&D for business enterprises and higher education, exports and 
	technology. If the focus is on increasing bilateral technology diffusion, it is necessary to increase expenditure on 
	R&D for higher education and technology.
Classification-JEL: F14, F21, O30, O57.
Keywords: International Technology Diffusion, Exports, Imports, Joint Patent, Cross-border Patent, R&D, Negative Binomial Panel Data.
Length: 42 pages
Revision-Date: 2015-05
Number: 2015-06 
X-File-Ref: http://america.sim.ucm.es/repec/ucm/ref/doicae1506.txt
File-URL: https://eprints.ucm.es/id/eprint/29534/1/1506.pdf
File-Format: Application/pdf
Handle: RePEc:ucm:doicae:1506